New ASIC chip for the internet of things
Coolant boiling and cooling are increasingly becoming critical components of an increasing number of IoT devices, as well as the internet.
A new chip by an Israeli company will bring coolant for the IoT and the internet in one device.
It is called Coolant for IoT, and it has already been designed to be able to deliver cooling to a range of devices, including mobile phones, tablets and smart TVs.
The chip, named Coolant-II, is part of the Intel Atom chip family, a group of processors designed for high-performance computing and communications.
It has been designed for a range with four cores and a dozen threads, and a power-to-use ratio of 0.8 per cent.
It will be made available to end users via Intel’s OpenCL 2.0 compiler and is expected to be available in early 2018.
Coolant-III is a second generation chip, and is based on the same architecture.
It uses a new Intel Xeon Scalable Processor-Broadwell-E family of processors, with an x86 instruction set and an instruction set extension, with 32 threads per core.
It also features an 8x DIMM slot, 64MB of DDR4 memory and an eight-bit USB 2.1 port.
The Intel Atom processors have been designed as a “platform for the future of personal computing”, with the company calling them a “high performance” part that offers performance improvements and higher-performance for IoT applications.
In a blog post, Intel said the Coolant II chip was designed to solve problems with power efficiency and low performance, and to provide better cooling performance for IoT devices.
The company said the chip is designed to run on Intel’s latest and greatest Atom architecture with an integrated Intel Turbo Boost technology and a 16MB L3 cache.
Intel said Coolant is “one of the most advanced chips” on the market and was designed “for the future” of IoT.
Coolants can be used in the cooling system for both smartphones and tablets, it added.
CoolANT will be available as part of an Intel OpenCL platform, which will be able, at Intel’s request, to provide an alternative to the CPU and the GPUs in a variety of IoT applications, including smart home and enterprise products, cloud services and gaming.
Intel also announced new Atom chips for other parts of the IoT, including the iMac and MacBook Pro.
Coolante is expected at an early date in Q1 2020.